CM1248 ? 08DE
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC ? 01
ISSUE O
C
EXPOSED Cu
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
0.05 C
8X 0.05 C
NOTE 4
D
TOP VIEW
DETAIL B
SIDE VIEW
A1
A
B
E
A
(A3)
SEATING
PLANE
L1
MOLD CMPD
A1 A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.70 BSC
D2 1.10 1.30
E 1.35 BSC
E2 0.30 0.50
e 0.40 BSC
K 0.15 ???
L 0.20 0.30
L1 ??? 0.05
8X
DETAIL A
L
1
D2
E2
RECOMMENDED
SOLDERING FOOTPRINT*
8X
K
8
8X b
1.40
8X
0.40
e
e/2
BOTTOM VIEW
0.10 C A B
0.05 C NOTE 3
PACKAGE
OUTLINE
0.50
1.55
8X
0.25
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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CM1248 ? 08DE/D
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